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High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

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High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance
High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

Large Image :  High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

Product Details:
Place of Origin: CHINA
Brand Name: KAMTAI
Certification: SGS
Model Number: KTALP6-1
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: CARTON BOX AND PLYWOOD PALLET
Delivery Time: 25 DAYS AFTER PAYMENT
Payment Terms: L/C, T/T, Western Union, MoneyGram,PAYPAL
Supply Ability: 20000PCS/ MONTH

High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

Description
Color: Ivory White Name: High Thermal Conductivity Alumina Ceramic Substrate With High Heat Resistance
Bulk Density: 3.6g/cm3 Usage: Circuit Insulation
MOQ: 10PCS Type: Ceramic Plate
High Light:

porous ceramic disc

,

alumina ceramic tube

 

High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

 

1. Description 

Alumina ceramic  is widely used in many fields. Because of its great performance, it is more and more used in curent society, alumina ceramic substrate can meet the requirement of daily using and specifical features.

Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double) at high temperature. The made of ultra-thin composite substrate with excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and the same as the PCB can be etched a variety of graphics, with a large current carrying ability. Therefore, the ceramic substrate has become the basis of high-power power electronic circuit structure technology and interconnect technology.
 
2. Main Features

1. Can be made into various of complex shapes, high dimension accuracy.

2. Contact with flame directly,no odor and volatile gases at high temperatures
3. High mechanical strength,resistance to gas flow.
4. Low shrinkage,low thermal conductivity.
5. Excellent strength in high temperature and thermal stability.

 

3. Specification 

Item
Unit
95% Alumina ceramic
99% Alumina ceramic
Bulk density
g/cm3
>3.6
3.89
Max use temperature
1500
1700
Water absorbtion
%
0
0
Bending Strength
Mpa
364
450
Expansion (25-800°C)
(X10-6/°C)
7.6
8
Thermal Conductivity
(W/(m.R))
20
35
Dielectric Strength
(kv/mm)
11
12

 

Application:

1. High Power Power Semiconductor Modules; Semiconductor Coolers, Electronic Heaters; Power Control Circuits, Power Hybrid Circuits.
2. Smart Power Components; High Frequency Switching Power Supply, Solid State Relays.
3.Automotive, Aerospace and Military Electronics Components.
4. Solar panel components; telecommunications switches, receiving systems; lasers and other industrial electronics.

 

 
High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance 0
 
 

Contact Details
Yixing City Kam Tai Refractories Co.,ltd

Contact Person: tao

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